PCB board-level process quality evaluation

Short Description:

The quality problems of electronic product process account for 80% of the whole in mature automotive electronics suppliers. At the same time, abnormal process quality could cause product failure, and even the abnormal in entire system, resulting in batch recalls, causing serious losses to electronic product manufacturers, and further posing a threat to the lives of passengers.

With more than 10 years of experience in failure analysis, GRGT has the capability to provide automotive and electronic PCB board-level process quality evaluation, including VW80000 series, ES90000 series etc., assisting enterprises finding potential quality defects and further controlling product quality risks.

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Product Detail

Product Tags

Service Scope

PCB, PCBA, automotive welding parts

Test standards:

OEM standards

Korean (including joint venture) - ES90000 series;

Japanese (including joint venture) - TSC0507G, TSC0509G, TSC0510G, TSC3005G series;

German (including joint venture) - VW80000 series;

American (including joint venture) - GMW3172;

Greely automobile series standards;

Chery automobile series standards;

FAW automobile series standards;

Other industry standards, national standards, military standards etc.：

GB/2423A

JEDEC JESD22

NSIPCI

J-STD-020

J-STD-001

J-STD-002

J-STD-003

IPC-A610

IPC-TM-650

IPC-9704

IPC-6012

IPC-6013

JISZ3198

IEC60068

Test items

Test type	Test items
Flux test items	Solid content Solderability Halogen content Surface Insulation Resistance Electromigration etc.
Solder paste test items	Particle size Viscosity Bridging Collapse Wettability Tin whiskers Intermetallic compound Insulation resistance Ion migration
PCB base material test project	Water absorption Dielectric constant Withstand voltage Surface resistivity Volume resistivity
PCB bare board test project	Appearance inspection Contact resistance Adhesion Microsection Thermal Stress Solderability Hot oil Withstand voltage SIR/CAF High temperature storage Temperature shock Temperature and humidity bias
PCBA soldering (lead-free process) pilot project	Microsection X-ray Shear strength Bond strength Sound sweep Thermal Imaging Ion pollution Organic pollution Electromigration Tin whiskers Red ink dyeing Micro strain test Environmental stress such as temperature and mechanical test
Interior and exterior decoration test items	Coating thickness Bond strength Preservative Microporous / microcracked chrome Potential difference Other environmental stress tests
Environmental stress test project	High temperature work Temperature cycle High temperature storage Low temperature storage Pressure HAST High temperature and high humidity bias High temperature and high humidity work Low temperature work Wake-up from low temperature 3/5/9 point function check Power temperature cycle Vibration Shock Drop Three comprehensives Salt spray Condensation