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PCB board-level process quality evaluation

Short Description:

In mature automotive electronics suppliers, process-related quality issues account for 80% of overall problems. Abnormal process quality can lead to product failures, disrupt the entire system, and result in large-scale recalls, causing significant financial losses for manufacturers. In some cases, it even poses a safety risk to passengers.

With over 10 years of experience in failure analysis, GRGT offers automotive and electronic PCB board-level process quality evaluations, including VW80000 and ES90000 series. This expertise helps enterprises identify potential quality defects and better manage product quality risks.


Product Detail

Product Tags

Service Scope

PCB, PCBA, automotive welding parts

Test standards:

OEM standards

Korean (including joint venture) - ES90000 series;

Japanese (including joint venture) - TSC0507G, TSC0509G, TSC0510G, TSC3005G series;

German (including joint venture) - VW80000 series;

American (including joint venture) - GMW3172;

Greely automobile series standards;

Chery automobile series standards;

FAW automobile series standards;

Other industry standards, national standards, military standards etc.

GB/2423A

JEDEC JESD22

NSIPCI

J-STD-020

J-STD-001

J-STD-002

J-STD-003

IPC-A610

IPC-TM-650

IPC-9704

IPC-6012

IPC-6013

JISZ3198

IEC60068

Test items

Test type

Test items

Flux test items

  • Solid content
  • Solderability
  • Halogen content
  • Surface Insulation Resistance
  • Electromigration
  • etc.

Solder paste test items

  • Particle size
  • Viscosity
  • Bridging
  • Collapse
  • Wettability
  • Tin whiskers
  • Intermetallic compound
  • Insulation resistance
  • Ion migration

PCB base material test project

  • Water absorption
  • Dielectric constant
  • Withstand voltage
  • Surface resistivity
  • Volume resistivity

PCB bare board test project

  • Appearance inspection
  • Contact resistance
  • Adhesion
  • Microsection
  • Thermal Stress
  • Solderability
  • Hot oil
  • Withstand voltage
  • SIR/CAF
  • High temperature storage
  • Thermal shock
  • Thermal and humidity bias

PCBA soldering (lead-free process) pilot project

  • Cross-section
  • X-ray
  • Shear test
  • Pull test
  • Acoustic Scanning
  • Thermal Imaging
  • Ion  Contamination
  • Organic pollution
  • Electromigration
  • Tin whiskers
  • Red ink inspection
  • Micro strain test

Interior and exterior decoration test items

  • Coating thickness
  • Bond strength
  • Preservative
  • Microporous / microcracked chrome
  • Potential difference
  • Other environmental stress tests

Environmental stress test project

  • High temperature work
  • Temperature cycle
  • High temperature storage
  • Low temperature storage
  • Pressure
  • HAST
  • High temperature and high humidity bias
  • High temperature and high humidity work
  • Low temperature work
  • Wake-up from low temperature
  • 3/5/9 point function check
  • Power temperature cycle
  • Vibration
  • Shock
  • Drop
  • Three comprehensives
  • Salt spray
  • Condensation

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