PCBA strain measurement consists of placing a strain gauge near a specified component on a printed board, and then subjecting the printed board with the strain gauge to various tests, assemblies, and manual operations.
According to the industry standard IPC_JEDEC-9704A, typical manufacturing steps requiring strain measurement are as follows: 1) SMT assembly process, 2) printed board test process, 3) mechanical assembly, and 4) transportation and handling.
Printed board assembly strain measurement
Source:IPC_JEDEC-9704A
System assembly strain measurement
Source:IPC_JEDEC-9704A
Post time: Apr-25-2024
