Microstructure analysis and evaluation of semiconductor materials
Service Introduction
With the continuous development of large-scale integrated circuits, the chip manufacturing process is becoming more and more complex, and the abnormal microstructure and composition of semiconductor materials hinder the improvement of chip yield, which brings great challenges to the implementation of new semiconductor and integrated circuit technologies.
GRGTEST provides comprehensive semiconductor material microstructure analysis and evaluation to help customers improve semiconductor and integrated circuit processes，including preparation of wafer level profile and electronic analysis, comprehensive analysis of physical and chemical properties of semiconductor manufacturing related materials, formulation and implementation of semiconductor material contaminant analysis program.
Service scope
Semiconductor materials, organic small molecule materials, polymer materials, organic/inorganic hybrid materials, inorganic non-metallic materials
Service program
1. Chip wafer level profile preparation and electronic analysis, based on focused ion beam technology (DB-FIB), precise cutting of the local area of the chip, and real-time electronic imaging, can obtain the chip profile structure, composition and other important process information;
2. Comprehensive analysis of physical and chemical properties of semiconductor manufacturing materials, including organic polymer materials, small molecule materials, inorganic non-metallic materials composition analysis, molecular structure analysis, etc.;
3. Formulation and implementation of contaminant analysis plan for semiconductor materials. It can help customers fully understand the physical and chemical characteristics of pollutants, including: chemical composition analysis, component content analysis, molecular structure analysis and other physical and chemical characteristics analysis.
Service Items
|
Service type |
Service items |
|
Elemental composition analysis of semiconductor materials |
l EDS elemental analysis,
l X-ray photoelectron spectroscopy (XPS) elemental analysis |
|
Molecular structure analysis of semiconductor materials |
l FT-IR infrared spectrum analysis,
l X-ray diffraction (XRD) spectroscopic analysis, l Nuclear magnetic resonance pop Analysis (H1NMR, C13NMR) |
|
Microstructure analysis of semiconductor materials |
l Double focused ion beam (DBFIB) slice analysis,
l Field emission scanning electron microscopy (FESEM) was used to measure and observe the microscopic morphology, l Atomic force microscopy (AFM) for surface morphology observation |
-
Phone
-
E-mail
-
Top