Currently, DB-FIB (Dual Beam Focused Ion Beam) is widely applied in research and product inspection across fields such as:
Ceramic materials,Polymers,Metallic materials,Biological studies,Semiconductors,Geology
Semiconductor materials, organic small molecule materials, polymer materials, organic/inorganic hybrid materials, inorganic non-metallic materials
With the rapid advancement of semiconductor electronics and integrated circuit technologies, the increasing complexity of device and circuit structures has raised the requirements for microelectronic chip process diagnostics, failure analysis, and micro/nano fabrication. The Dual Beam FIB-SEM system, with its powerful precision machining and microscopic analysis capabilities, has become indispensable in microelectronic design and manufacturing.
The Dual Beam FIB-SEM system integrates both a Focused Ion Beam (FIB) and a Scanning Electron Microscope (SEM). It enables real-time SEM observation of FIB-based micromachining processes, combining the high spatial resolution of the electron beam with the precision material processing capabilities of the ion beam.
Site-Specific Cross-Section Preparation
TEM Sample Imaging and Analysis
Selective Etching or Enhanced Etching Inspection
Metal and Insulating Layer Deposition Testing