AQG324 Power Device Certification
Service Introduction
The ECPE Working Group AQG 324 established in June 2017 is working on a European Qualification Guideline for Power Modules for Use in Power Electronics Converter Units in Motor Vehicles.
Based on the former German LV 324 (´Qualification of Power Electronics Modules for Use in Motor Vehicle Components - General Requirements, Test Conditions and Tests´) the ECPE Guideline defines a common procedure for characterizing module testing as well as for environmental and lifetime testing of power electronic modules for automotive application.
The guideline has been released by the responsible Industrial Working Group comprising ECPE member companies with more than 30 industry representatives from the automotive supply chain.
The present AQG 324 version dated 12 April 2018 focuses on Si-based power modules where future versions to be released by the Working Group will also cover the new wide bandgap power semiconductors SiC and GaN.
By deeply interpreting AQG324 and related standards from expert team, GRGT has established the technical capabilities of power module verification, providing authoritative AQG324 inspection and verification reports for up- and down-stream enterprises in the power semiconductor industry.
Service Scope
Power device modules and equivalent special design products based on discrete devices
Test standards
● DINENISO/IEC17025：General Requirements for the Competence of Testing and Calibration Laboratories
● IEC 60747：Semiconductor Devices, Discrete Devices
● IEC 60749：Semiconductor Devices ‒ Mechanical and Climatic Test Methods
● DIN EN 60664：Insulation Coordination for Equipment Within Low-Voltage Systems
● DINEN60069：Environmental Testing
● JESD22-A119:2009：Low Temperature Storage Life
Test items
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Test type |
Test items |
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Module detection |
Static parameters, dynamic parameters, connection layer detection (SAM), IPI/VI, OMA |
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Module characteristic test |
Parasitic stray inductance, thermal resistance, short circuit withstand, insulation test, mechanical parameter detection |
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Environmental test |
Thermal shock, mechanical vibration, mechanical shock |
|
Life test |
Power cycling (PCsec, PCmin), HTRB, HV-H3TRB, dynamic gate bias, dynamic reverse bias, dynamic H3TRB, body diode bipolar degradation |
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